A vacuum-based bonding mechanism for modular robotics

Ricardo Franco Mendoza Garcia
,
Jochen Hiller
,
Kasper Støy
,
Hod Lipson

University of Southern Denmark

Research Output:

Journal Article or Conference Article in Journal

Journal article

Publication Information

Output type

Research Output:

Journal Article or Conference Article in Journal

Journal article

Original language

Undefined/Unknown

Pages from-to (Number of pages)

Pages 876-890 (15 pages)

Journal (Volume, Issue Number)

I E E E Transactions on Robotics (Volume 27, Issue 5)

Publication milestones

Published - 09/06/2011

Publication status

Published - 09/06/2011

ISSN

1552-3098

Publication IDs

Scopus: 80053642950

Abstract

We explore vacuum as bonding force for modular robotics. Vacuubes are a set of modules that propagate vacuum across their interfaces in order to generate adhesive forces to form and hold structures. We use analog circuits to simulate vacuum transients and understand critical design parameters and then validate these insights in experiments. A 49-module structure that employs vacuum bonding is demonstrated. We conclude that vacuum offers a relatively strong, simple, reliable, and power-efficient connection principle.

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